Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-01-26
2010-02-02
Luu, Chuong A. (Department: 2892)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S692000, C438S729000, C438S714000
Reexamination Certificate
active
07655565
ABSTRACT:
A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially outward of substrate with a polarity opposite the bias applied tot he first electrode.
REFERENCES:
patent: 3162588 (1964-12-01), Bell
patent: 3448023 (1969-06-01), Bell
patent: 3873512 (1975-03-01), Latanision
patent: 4119515 (1978-10-01), Costakis
patent: 4125444 (1978-11-01), Inoue
patent: 4713149 (1987-12-01), Hoshino
patent: 4793895 (1988-12-01), Kaanta et al.
patent: 4839993 (1989-06-01), Masuko et al.
patent: 4934102 (1990-06-01), Leach et al.
patent: 4954141 (1990-09-01), Takiyama et al.
patent: 4956056 (1990-09-01), Zubatova et al.
patent: 5096550 (1992-03-01), Mayer
patent: 5136817 (1992-08-01), Tabata et al.
patent: 5217586 (1993-06-01), Datta et al.
patent: 5225034 (1993-07-01), Yu et al.
patent: 5534106 (1996-07-01), Cote et al.
patent: 5543032 (1996-08-01), Datta et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5575706 (1996-11-01), Tsai et al.
patent: 5578362 (1996-11-01), Reinhardt et al.
patent: 5624300 (1997-04-01), Kishii et al.
patent: 5637031 (1997-06-01), Chen
patent: 5674758 (1997-10-01), McCarthy
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5766446 (1998-06-01), Spindt et al.
patent: 5804507 (1998-09-01), Perlov et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5846882 (1998-12-01), Birang
patent: 5871392 (1999-02-01), Meikle et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5911619 (1999-06-01), Uzoh et al.
patent: 5931719 (1999-08-01), Nagahara et al.
patent: 5938801 (1999-08-01), Robinson
patent: 5966151 (1999-10-01), Wakahara
patent: 6001008 (1999-12-01), Fujimori et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6010395 (2000-01-01), Nakajima
patent: 6017265 (2000-01-01), Cook et al.
patent: 6020264 (2000-02-01), Lustig et al.
patent: 6024630 (2000-02-01), Shendon et al.
patent: 6051116 (2000-04-01), Ichinose et al.
patent: 6056851 (2000-05-01), Hsieh et al.
patent: 6066030 (2000-05-01), Uzoh
patent: 6068818 (2000-05-01), Ackley et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6103096 (2000-08-01), Datta et al.
patent: 6116998 (2000-09-01), Damgaard et al.
patent: 6141027 (2000-10-01), Akutsu et al.
patent: 6153043 (2000-11-01), Edelstein et al.
patent: 6156124 (2000-12-01), Tobin
patent: 6159079 (2000-12-01), Zuniga et al.
patent: 6171467 (2001-01-01), Weihs et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6210257 (2001-04-01), Carlson
patent: 6234870 (2001-05-01), Uzoh et al.
patent: 6238271 (2001-05-01), Cesna
patent: 6244935 (2001-06-01), Birang et al.
patent: 6248222 (2001-06-01), Wang
patent: 6273798 (2001-08-01), Berman
patent: 6297159 (2001-10-01), Paton
patent: 6328872 (2001-12-01), Talieh et al.
patent: 6358118 (2002-03-01), Boehm et al.
patent: 6368184 (2002-04-01), Beckage
patent: 6368190 (2002-04-01), Easter et al.
patent: 6379223 (2002-04-01), Sun et al.
patent: 6381169 (2002-04-01), Bocian et al.
patent: 6386956 (2002-05-01), Sato et al.
patent: 6391166 (2002-05-01), Wang
patent: 6395152 (2002-05-01), Wang
patent: 6402591 (2002-06-01), Thornton
patent: 6406363 (2002-06-01), Xu et al.
patent: 6409904 (2002-06-01), Uzoh et al.
patent: 6413388 (2002-07-01), Uzoh et al.
patent: 6413403 (2002-07-01), Lindquist et al.
patent: 6440295 (2002-08-01), Wang
patent: 6447668 (2002-09-01), Wang
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6482307 (2002-11-01), Ashjaee et al.
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6582281 (2003-06-01), Doan et al.
patent: 6612904 (2003-09-01), Boehm et al.
patent: 6630059 (2003-10-01), Uzoh et al.
patent: 6638863 (2003-10-01), Wang et al.
patent: 6689258 (2004-02-01), Lansford et al.
patent: 6726823 (2004-04-01), Wang et al.
patent: 6776693 (2004-08-01), Duboust et al.
patent: 2001/0005667 (2001-06-01), Tolles et al.
patent: 2001/0024878 (2001-09-01), Nakamura
patent: 2001/0027018 (2001-10-01), Molnar
patent: 2001/0036746 (2001-11-01), Sato et al.
patent: 2001/0040100 (2001-11-01), Wang
patent: 2001/0042690 (2001-11-01), Talieh
patent: 2002/0008036 (2002-01-01), Wang
patent: 2002/0011417 (2002-01-01), Talieh et al.
patent: 2002/0020621 (2002-02-01), Uzoh et al.
patent: 2002/0025760 (2002-02-01), Lee et al.
patent: 2002/0025763 (2002-02-01), Lee
patent: 2002/0070126 (2002-06-01), Sato et al.
patent: 2002/0077037 (2002-06-01), Tietz
patent: 2002/0088715 (2002-07-01), Talieh et al.
patent: 2002/0108861 (2002-08-01), Emesh
patent: 2002/0119286 (2002-08-01), Chen et al.
patent: 2002/0130049 (2002-09-01), Chen et al.
patent: 2003/0104762 (2003-06-01), Sato et al.
patent: 2003/0114087 (2003-06-01), Duboust et al.
patent: 2003/0116446 (2003-06-01), Duboust et al.
patent: 2003/0213703 (2003-11-01), Wang et al.
patent: 2003/0234184 (2003-12-01), Liu et al.
patent: 2004/0023495 (2004-02-01), Butterfield et al.
patent: 2004/0023610 (2004-02-01), Hu et al.
patent: 2004/0121708 (2004-06-01), Hu et al.
patent: 2004/0154931 (2004-08-01), Hongo et al.
patent: 2006/0057812 (2006-03-01), Liu et al.
patent: 0 325 753 (1989-08-01), None
patent: 0 455 455 (1991-11-01), None
patent: 1 103 346 (2000-11-01), None
patent: 11042554 (1999-02-01), None
patent: 2001-77117 (2002-09-01), None
patent: 528649 (2003-04-01), None
patent: 536450 (2003-06-01), None
patent: 542768 (2003-07-01), None
patent: 200302150 (2003-08-01), None
patent: WO 98/49723 (1998-11-01), None
patent: WO 99/41434 (1999-08-01), None
patent: WO 99/53119 (1999-10-01), None
patent: WO 00/03426 (2000-01-01), None
patent: WO 00/024394 (2000-05-01), None
patent: WO 00/26443 (2000-05-01), None
patent: WO 00/33356 (2000-06-01), None
patent: WO 00/59682 (2000-10-01), None
patent: WO 01/49452 (2001-07-01), None
patent: WO 01/88229 (2001-11-01), None
patent: WO 02/23616 (2002-03-01), None
patent: WO 02/064314 (2002-08-01), None
patent: WO 03/001581 (2003-01-01), None
Contolini “Electrochemical Planarization of ULSI Copper,”Solid State Technology; vol. 40, No. 6, Jun. 1, 1997, pp. 155-156, 158, 160, 162.
D. Landoit, “Fundamental Aspects of Electropolishing”, Mar. 18, 1996, pp. 1-11.
Nogami “An Innovation to Integrate Porous Low-K Materials and Copper”,InterConnect Japan 2001; Honeywell Seminar (Dec. 6, 2001); pp. 1-12.
Partial International Search Report for US 02/40754 dated Apr. 28, 2003.
PCT International Preliminary Examination Report for PCT/US02/04806, dated Sep. 7, 2004.
PCT International Preliminary Examination Report for PCT/US03/06058, dated Sep. 7, 2004.
PCT International Search Report for PCT/US 02/11009 dated Feb. 6, 2003.
PCT International Search Report for PCT/US03/01760 dated May 27, 2003.
PCT International Search Report for PCT/US03/29230 dated Feb. 3, 2004.
PCT International Search Report for US 02/04806 dated Apr. 1, 2003.
PCT International Search Report for US 03/06058 dated Jun. 25, 2003.
PCT Written Opinion for PCT/US02/04806, dated Mar. 9, 2004.
PCT Written Opinion for PCT/US03/01760 dated Mar. 8, 2004.
PCT Written Opinion for PCT/US03/06058, dated Feb. 13, 2004.
PCT Invitation to Pay Additional Fees for PCT/USO4/006385 dated Mar. 22, 2005.
PCT International Search Report for PCT/US04/006385 dated May 17, 2005.
PCT Written Opinion for PCT/US04/006385 dated May 17, 2005.
PCT International Search Report and Written Opinion dated Jun. 30, 2006 for PCT/US2006/002595.
Notice of Allowance of Taiwan Application No. 95102669 dated Jun. 14, 2007.
Notice to File a Response dated Jan. 19, 2009 for Korean Patent Application No. 10-2007-7018157.
First Office Action for CN 200680002929.1, Aug. 1, 2008, consists of 6 pages.
Chen Liang-Yuh
Duboust Alain
Galburt Vladimir
Manens Antoine P.
Olgado Donald J. K.
Applied Materials Inc.
Luu Chuong A.
Patterson & Sheridan LLP
LandOfFree
Electroprocessing profile control does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Electroprocessing profile control, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electroprocessing profile control will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4174982