Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2003-10-09
2008-12-09
Pham, Thanh V (Department: 2894)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S734000, C257S737000, C257S738000, C257S780000, C257S783000, C257SE23021, C438S612000, C438S613000, C438S614000, C438S652000, C438S654000, C438S660000, C438S666000, C438S687000, C438S688000
Reexamination Certificate
active
07462942
ABSTRACT:
A die, comprising a substrate and one or more pillar structures formed over the substrate in a pattern and the method of forming the die.
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“Advanced Connections,” Spring 2002, Advanced Interconnect Technologies, pp. 1-8.
Bong Yin Yen
Lui Shikui
Nang Htoi Ma L.
Shen Ch'ng Han
Sivagnanam Balasubramanian
Ackerman Stephen B.
Advanpack Solutions Pte Ltd
Pham Thanh V
Saile Ackerman LLC
Stanton Stephen G.
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