4. Semiconductor device manufacturing: process
  5. Making device or circuit emissive of nonelectrical signal
  6. Including integrally formed optical element

Stephen G. Stanton

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Aluminum/copper clad interconnect layer for VLSI applications

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Anodic bonding process for ceramics

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate

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Aperture width reduction method for forming a patterned...

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate

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Bump reflow method by inert gas plasma

Metal fusion bonding – Process – Plural joints
Reexamination Certificate

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Chemical mechanical polish (CMP) planarizing method with...

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Profile ID: LFUS-PAI-P-2010758

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