4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Advanpack Solutions Pte Ltd

Corporate Assignee

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Corporate Assignee

active

No affiliations

Die pillar structures and a method of their formation

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Package design and method of manufacture for chip grid array

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Advanpack Solutions Pte Ltd does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Advanpack Solutions Pte Ltd, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Advanpack Solutions Pte Ltd will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-3171658

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure