Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-06-02
1997-12-02
Breneman, R. Bruce
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
216 59, 216 63, 216 67, 216 71, 20419232, 20419233, 427569, H01L 21306, C23C 1434, H05H 124
Patent
active
056931794
ABSTRACT:
A plasma etch chamber includes a modified focus ring which is used in conjunction with chamber pressure throttling to eject contaminants in the focus ring away from the substrate just before the etching cycle is completed. Additionally, process gas is directed against the inner wall of the chamber to create a swirling flow of plasma within the chamber and thus disturb any contaminant-generating field adjacent the chamber wall. A process gas, or a non-reactive purge gas, may also be supplied from a diffuser atop the cathode, to direct a gas layer along the top and sides of the chamber to reduce contaminant build-up on the chamber surfaces.
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Blackburn Greg
Kava Joseph
McGovern Richard
Rozenzon Yan
Applied Materials Inc.
Breneman R. Bruce
McDonald Rodney G.
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