Composite metal column for mounting semiconductor device

Details Composite metal column for mounting semiconductor device Composite metal column for mounting semiconductor device

2006-10-24

2006-10-24

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S108000, C438S613000, C029S843000

Reexamination Certificate

active

07125789

ABSTRACT:
An integrated circuit chip903, which has a plurality of pads903band non-reflowable contact members1201to be connected by reflow attachment to external parts. Each of these contact members1201has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermo-mechanical stress. The members have a solderable surface1202on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad903b, while the other end (1203) of each member is operable for reflow attachment to external parts.

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patent: 0 704 895 (1996-04-01), None
patent: WO 97/19466 (1997-05-01), None

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