4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including adhesive bonding step

John P. Tellkamp

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Aluminum leadframes for semiconductor devices and method of...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Aluminum leadframes with two nickel layers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Anti-corrosion overcoat cover tape

Special receptacle or package – Holder for a removable electrical component – Bar or tapelike carrier for plural components
Reexamination Certificate

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Composite metal column for mounting semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Leadframes for improved moisture reliability and enhanced...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2341836

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