4. Package making
  5. Methods
  6. Annular package

Akira Matsunami

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Apparatus for wrapping the end surface of cylindrical object

Package making – Closing packages and filled receptacles – Package or receptacle having closure flap – e.g. – carton...
Patent

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Ball film for integrated circuit fabrication and testing

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Ball film for integrated circuit fabrication and testing

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Composite metal column for mounting semiconductor device

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Composite metal column for mounting semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1220347

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