4. Adhesive bonding and miscellaneous chemical manufacture
  5. Methods
  6. Surface bonding and/or assembly therefor

Pao-Yun Tang

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Composite bump tape automated bonded structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Patent

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Composite bump tape automated bonding method and bonded structur

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent

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Connection construction and method of manufacturing the same

Fishing – trapping – and vermin destroying
Patent

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Display panel

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Electrical conducting structure and liquid crystal display...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1041705

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