Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1995-07-26
1998-01-13
Niebling, John
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438613, H01L 2144
Patent
active
057079021
ABSTRACT:
A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing. A base metal pad covering the integrated circuit element input/output pad can be used to provide added flexibility in location of the composite bump. The composite bump can be formed directly on the input/output pad or on the base metal pad.
REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3625837 (1971-12-01), Nelson et al.
patent: 3809625 (1974-05-01), Brown et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4763829 (1988-08-01), Sherry
patent: 4916523 (1990-04-01), Sokolovsky et al.
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5086558 (1992-02-01), Grube et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5223454 (1993-06-01), Uda et al.
patent: 5329423 (1994-07-01), Scholz
patent: 5393696 (1995-02-01), Koh et al.
patent: 5393697 (1995-02-01), Chang et al.
Ward, W.C. "Pressure Contact Type Chip Join Technique", IBM Technical Disclosure Bulletin, vol. 18, No. 9., p. 2817, Feb. 1976.
Tummala et al, "Microlelectronics Packaging handbook", Van Nostrand Reinhold, pp. 361-373, 1989.
Wolf et al, "Silicon Processing For The VLSI Era Volume 1: Process Technology", Lattice Press, pp. 407-430, 1986.
Chang Shyh-Ming
Jou Jwo-Huei
Lee Yu-Chi
Ackerman Stephen B.
Industrial Technology Research Institute
Lebentritt Michael S.
Niebling John
Prescott Larry J.
LandOfFree
Composite bump structure and methods of fabrication does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Composite bump structure and methods of fabrication, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite bump structure and methods of fabrication will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-325845