4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Jwo-Huei Jou

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Composite bump structure and methods of fabrication

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent

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Composite bump structure and methods of fabrication

Fishing – trapping – and vermin destroying
Patent

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Composite bump structures

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent

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Electroluminescent device with drying film and method for...

Electric lamp and discharge devices – With luminescent solid or liquid material – Solid-state type
Reexamination Certificate

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Method for bonding IC chips having multi-layered bumps with...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-537047

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