CMOS on SOI substrates with hybrid crystal orientations

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S150000, C438S154000, C438S198000, C438S221000, C438S404000, C257S064000, C257S068000, C257S351000, C257SE21562

Reexamination Certificate

active

07432149

ABSTRACT:
Methods and structures for CMOS devices with hybrid crystal orientations using double SOI substrates is provided. In accordance with preferred embodiments, a manufacturing sequence includes the steps of forming an SOI silicon epitaxy layer after the step of forming shallow trench isolation regions. The preferred sequence allows hybrid SOI CMOS fabrication without encountering problems caused by forming STI regions after epitaxy. A preferred device includes an NFET on a {100} crystal orientation and a PFET on a {110} crystal orientation. An NMOS channel may be oriented along the <100> direction, which is the direction of maximum electron mobility for a {100} substrate. A PMOS channel may be oriented along the <110> direction, which is the direction where hole mobility is maximum for a {110} substrate.

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