Chemical mechanical polishing a substrate having a filler...

Details Chemical mechanical polishing a substrate having a filler... Chemical mechanical polishing a substrate having a filler...

2007-04-10

2007-04-10

Morgan, Eileen P. (Department: 3723)

Abrading

Precision device or process - or with condition responsive...

With indicating

C451S011000, C451S006000, C451S041000, C451S037000, C451S060000

Reexamination Certificate

active

11075778

ABSTRACT:
A substrate is chemical mechanical polished with a high-selectivity slurry until the stop layer is at least partially exposed, and then the substrate is polished with a low-selectivity slurry until the stop layer is completely exposed.

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