4. Static information storage and retrieval
  5. Read/write circuit
  6. Flip-flop used for sensing

Terry Tsai

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Carrier-free semiconductor package and fabrication method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Carrier-free semiconductor package and fabrication method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Synchronous DRAM with alternated data line sensing

Static information storage and retrieval – Read/write circuit – Flip-flop used for sensing
Patent

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Profile ID: LFUS-PAI-P-1581605

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