4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Fu-Di Tang

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Carrier-free semiconductor package and fabrication method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Carrier-free semiconductor package and fabrication method...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Encapsulated semiconductor device with flash-proof structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Leadframe with dot array of silver-plated regions on die pad...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package with a support structure and...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2201832

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