Base oxide engineering for high-K gate stacks

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate

Reexamination Certificate

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C438S151000

Reexamination Certificate

active

07939396

ABSTRACT:
A method of forming a semiconductor structure includes providing a semiconductor substrate, performing a hydrogen annealing to the semiconductor substrate, forming a base oxide layer after the step of hydrogen annealing, and forming a high-k dielectric layer on the base oxide layer.

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Chang, V.S., et al., “Modeling and Engineering of Hafnium Silicate (HfSiO) Gate Dielectric Deposited by Nano-Laminated Atomic Layer Deposition (NL-ALD)”, in press, ECS Transaction, vol. 1, 11 pages (2006).
Hsu, P.F., et al., “Advanced Dual Metal Gate MOSFETs with High-k Dielectric for CMOS Application”, VLSI Symp. Tech. Dig., 2 pages (2006).

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