Back end interconnect with a shaped interface

Details Back end interconnect with a shaped interface Back end interconnect with a shaped interface

2006-08-09

2009-02-24

Chen, Jack (Department: 2893)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S637000

Reexamination Certificate

active

07494915

ABSTRACT:
An interconnect structure in the back end of the line of an integrated circuit forms contacts between successive layers by removing material in the top surface of the lower interconnect in a cone-shaped aperture, the removal process extending through the liner of the upper aperture, and depositing a second liner extending down into the cone-shaped aperture, thereby increasing the mechanical strength of the contact, which then enhance the overall reliability of the integrated circuit.

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patent: 2004/0115928 (2004-06-01), Malhotra et al.
patent: 2000332143 (2000-11-01), None

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