Back end integrated WLCSP structure without aluminum pads

Details Back end integrated WLCSP structure without aluminum pads Back end integrated WLCSP structure without aluminum pads

2011-01-04

2011-01-04

Wilson, Allan R (Department: 2815)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257SE23021

Reexamination Certificate

active

07863742

ABSTRACT:
An integrated circuit structure includes a passivation layer; a via opening in the passivation layer; a copper-containing via in the via opening; a polymer layer over the passivation layer, wherein the polymer layer comprises an aperture, and wherein the copper-containing via is exposed through the aperture; a post-passivation interconnect (PPI) line over the polymer layer, wherein the PPI line extends into the aperture and physically contacts the copper-via opening; and an under-bump metallurgy (UBM) over and electrically connected to the PPI line.

REFERENCES:
patent: 6930032 (2005-08-01), Sarihan et al.
patent: 2001/0026021 (2001-10-01), Honda
patent: 2004/0166661 (2004-08-01), Lei
patent: 2007/0184578 (2007-08-01), Lin et al.
patent: 2008/0284014 (2008-11-01), Lee et al.
patent: 2008/0308934 (2008-12-01), Alvarado et al.
patent: 2009/0057895 (2009-03-01), Lin et al.
patent: 2009/0309224 (2009-12-01), Lin et al.

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