4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Tjandra Winata Karta

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Back end integrated WLCSP structure without aluminum pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Chip holder with wafer level redistribution layer

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electromagnetic shielding using through-silicon vias

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Electromagnetic shielding using through-silicon vias

Active solid-state devices (e.g. – transistors – solid-state diode – With shielding
Reexamination Certificate

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Enhanced reliability of wafer-level chip-scale packaging...

Semiconductor device manufacturing: process – Chemical etching
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2175186

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