4. Electric heating
  5. Metal heating
  6. For bonding with pressure

Daniel Yang

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active

Back end integrated WLCSP structure without aluminum pads

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Decoration

Jewelry – symbolic insignia – and ornaments – Artificial plant life and holiday season decorations – Tree
Patent

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Locking electrode tip for resistance spot-welding

Electric heating – Metal heating – For bonding with pressure
Patent

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Profile ID: LFUS-PAI-P-1217297

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