Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
Inventor
active
Back end integrated WLCSP structure without aluminum pads
Bump structure
Method for fabricating pad redistribution layer
Method for forming solder bumps of increased height
Method for improving a solder bump adhesion bond to a UBM...
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Profile ID: LFUS-PAI-P-2263555