4. Metal fusion bonding
  5. With means to juxtapose and bond plural workpieces
  6. Including compliant cushioning medium
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Machine for bonding leads to non-coplanar substrates

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Patent

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Mechanism and process for compressing chips

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Reexamination Certificate

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Method and apparatus for mounting a flexible film semiconductor

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Patent

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Method and device for pressing workpiece

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Reexamination Certificate

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Methods of and apparatus for aligning and bonding workpieces

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Patent

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