Methods of and apparatus for aligning and bonding workpieces

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium

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228106, 29589, B23K 100

Patent

active

RE0287989

ABSTRACT:
Bonding machines have transparent elements on their bonding axes. Magnified optical means are positioned to view bonding tips and integrated-circuit chips simultaneously through the transparent elements thereby facilitating alignment of the chips to the tips. In one embodiment a bonding tip is transparent and a transparent compliant bonding member is utilized in conjunction with the tip to produce compliant bonds. Another embodiment utilizes a transparent tip in a "hard tip" type of bonding operation. A third embodiment utilizes a transparent tray closely positionable to the bonding tip. After alignment of the tip to one of the chips is achieved the tray is removed and bonding proceeds on an accurately positioned substrate.

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patent: 3374531 (1968-03-01), Bruce
patent: 3520055 (1970-07-01), Jannett
patent: 3533155 (1970-10-01), Coucoulas
patent: 3548493 (1970-12-01), Hubbard

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