Metal fusion bonding – With means to juxtapose and bond plural workpieces – Including compliant cushioning medium
Patent
1991-07-09
1993-04-13
Seidel, Richard K.
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Including compliant cushioning medium
228 447, B23K 3700
Patent
active
052014517
ABSTRACT:
Method and apparatus are disclosed for mounting a flexible film semiconductor chip carrier on a second level electronic package. The resulting electronic packaging structure includes electrically conductive spacers, such as solder balls or solder coated copper balls, which electrically interconnect outer lead bonding pads on the flexible film semiconductor chip carrier and corresponding bonding pads on the second level electronic package, and which physically support the flexible film of the semiconductor chip carrier substantially in a plane above the surface of the second level electronic package. This electronic packaging structure is made using a special assembly fixture comprising a base plate, a pressure insert with a resilient member, and a top plate. The flexible film semiconductor chip carrier with the spacers attached thereto is placed over the resilient member of the pressure insert which is clamped together with the second level electronic package between the top and base plates. Then, this assembly is heated to reflow the solder of the spacers, and the assembly fixture is disassembled,; leaving the flexible film semiconductor chip carrier mounted on the second level electronic package with the flexible film of the carrier having a planar geometry as desired.
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Desai Kishor V.
Franchak Nelson P.
Katyl Robert H.
Kohn Harold
Sholtes Tamar A.
International Business Machines Corp.
Miner James
Seidel Richard K.
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