Mechanism and process for compressing chips

Details Mechanism and process for compressing chips Mechanism and process for compressing chips

2007-05-22

2007-05-22

Weiss, Howard (Department: 2814)

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

C029S025010, C403S057000

Reexamination Certificate

active

10711378

ABSTRACT:
A chip compressing mechanism is provided. The chip compressing mechanism essentially comprises a loading component, a head component and a gimbal. The head component is disposed under the loading component, with a gap in-between. The gimbal is disposed between the loading component and the head component to support the gap therebetween.

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