Machine for bonding leads to non-coplanar substrates

Details Machine for bonding leads to non-coplanar substrates Machine for bonding leads to non-coplanar substrates

1989-05-16

1990-01-30

Ramsey, Kenneth J.

Metal fusion bonding

With means to juxtapose and bond plural workpieces

Including compliant cushioning medium

228 62, H01L 21603

Patent

active

048968110

ABSTRACT:
A machine for bonding leads from a chip to a substrate having top and bottom surfaces that are non-coplanar is comprised of a carrier for the substrate which includes a frame having a set of stops that terminate in a single plane and which are arranged in a pattern with a central opening. Also included in the carrier is a forcing mechanism which pushes on the bottom surface of the substrate such that the top surface of the substrate is pinned directly against all of the stops simultaneously and a portion of that top surface is exposed through the opening. This causes the exposed portion of the substrate's top surface to be aligned with the plane of the stops regardless of the degree of non-coplanarity that exists between the substrate's top and bottom surfaces. Further included in the machine are bonding blades which lie parallel to the single plane of the stops, and they move perpendicular to that plane through the opening to bond leads to the exposed top surface portion of the substrate as it is pinned to the stops.

REFERENCES:
patent: 3475814 (1969-11-01), Santangini
patent: 3574923 (1971-04-01), Cushman
patent: 3957185 (1976-05-01), Kauffman et al.
patent: 4573627 (1986-03-01), Miller et al.

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