4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated
  6. With specified encapsulant
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Underfill dispensing system for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Underfill integration for optical packages

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Use of nitrides for flip-chip encapsulation

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Wiring board

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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