Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate
2005-04-05
2005-04-05
Lam, Cathy F. (Department: 1775)
Active solid-state devices (e.g., transistors, solid-state diode
Encapsulated
With specified encapsulant
C257S687000, C257S795000, C257S789000, C361S762000
Reexamination Certificate
active
06876091
ABSTRACT:
The present invention provides a wiring board in which electronic components are embedded by means of an embedding resin which attains a high mounting density of the electronic components in the wiring board, which exhibits excellent electrical properties such as insulating property, which prevents random reflection of light, and which reduces non-uniformity in color of the resin during curing thereof. The present invention includes a wiring board in which electronic components are embedded by use of an embedding resin having a dielectric constant of less than or equal to about 5 and tan δ of less than or equal to about 0.08. The embedding resin preferably contains carbon black in an amount of less than or equal to about 1.4 mass %. Moreover, the embedding resin preferably contains at least a thermosetting resin and at least one inorganic filler.
REFERENCES:
patent: 5292688 (1994-03-01), Hsiao et al.
patent: 5468999 (1995-11-01), Lin et al.
patent: 5589714 (1996-12-01), Howard
patent: 5627107 (1997-05-01), Howard
patent: 5828126 (1998-10-01), Thomas
patent: 6129955 (2000-10-01), Papathomas et al.
patent: 6324067 (2001-11-01), Nishiyama
patent: 4-356998 (1992-12-01), None
patent: 6-326472 (1994-11-01), None
patent: 7-263619 (1995-10-01), None
patent: 11-45955 (1999-02-01), None
patent: 11-54939 (1999-02-01), None
patent: 11-67961 (1999-03-01), None
patent: 11-74648 (1999-03-01), None
patent: 11-126978 (1999-05-01), None
patent: 11-307687 (1999-11-01), None
patent: 2000-124352 (2000-04-01), None
Kashima Hisahito
Kojima Toshifumi
Obayashi Kazushige
Takeuchi Hiroki
Lam Cathy F.
Morgan & Lewis & Bockius, LLP
NGK Spark Plug Co. Ltd.
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