4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Chip mounted on chip
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Laminated chip electronic device and method of manufacturing...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Large multi-function integrated circuit device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Lead-free interconnection for electronic devices

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Patent

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Leadless leadframe package substitute and stack package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Low profile package for plural semiconductor dies

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Low profile stack semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Low profile stack semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Low profile stacked multi-chip package and method of forming...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

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Low profile stacking system and method

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0
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