Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Chip mounted on chip
Reexamination Certificate
2005-11-15
2005-11-15
Nelms, David (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Chip mounted on chip
C257S762000, C257S766000, C257S528000, C257S532000, C257S778000, C336S096000
Reexamination Certificate
active
06965167
ABSTRACT:
The present invention discloses a laminated chip electronic device and a method of manufacturing the same. In the laminated chip electronic device and the method of manufacturing the same according to the present invention, a body is made of a non-linear resistance coefficient material and has a plurality of conductive layers formed therein; an insulating layer is formed on the top, bottom, front and back surfaces of the body; and two electrodes are formed at the two ends of the body and electrically connected to the terminals of the conductive layers, respectively. Furthermore, in the present invention, two soldered interface layers are formed on the two electrodes, respectively.
REFERENCES:
patent: 4490706 (1984-12-01), Satou et al.
patent: 4525921 (1985-07-01), Carson et al.
Inpaq Technology Co. Ltd.
Ladas & Parry LLP
Nelms David
Tran Mai-Huong
LandOfFree
Laminated chip electronic device and method of manufacturing... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Laminated chip electronic device and method of manufacturing..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Laminated chip electronic device and method of manufacturing... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3489877