Non-sticking semi-conductor wafer clamp and method of making sam

Details Non-sticking semi-conductor wafer clamp and method of making sam Non-sticking semi-conductor wafer clamp and method of making sam

1996-09-16

1999-08-24

Bueker, Richard

Coating apparatus

Gas or vapor deposition

Work support

118500, 118503, 118504, 20429811, 20429815, 438758, C23C 1600

Patent

active

059420413

ABSTRACT:
A clamp used in clamping semi-conductor wafers during processing operations permits ready release of the wafer and avoids adherence of the clamp to materials deposited onto the wafer which otherwise tend to stick the wafer to the clamp. Adhesion of the deposited materials to the clamp is avoided by providing the clamping surfaces of the clamp with a minimum surface roughness achieved by machining, grinding, etching or other techniques.

REFERENCES:
patent: 4964594 (1990-10-01), Webb
patent: 5391275 (1995-02-01), Mintz
patent: 5513594 (1996-05-01), McClanahan
patent: 5556500 (1996-09-01), Hasegawa et al.

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