Manufacturing method for a semiconductor substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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Reexamination Certificate

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10726005

ABSTRACT:
A method for manufacturing a semiconductor substrate of a first concentration type is described, which comprises at least a buried insulating cavity, comprising the following steps:forming on the semiconductor substrate a plurality of trenches,forming a surface layer on the semiconductor substrate in order to close superficially the plurality of trenches forming in the meantime at least a buried cavity in correspondence with the surface-distal end of the trenches.

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European Search Report for 02425742.0 dated Aug. 6, 2003.
Tsunashima, et al. “A New Substrate Engineering Technique to Realize Silicon on Nothing” Electrochemical Society Proceedings, Electrochemical Society, Pennington, NJ, US, No. 17, 2000, pp. 532-545, XP008004134 ISSN: 0161-6374.
Sato, et al., “SON (silicon on nothing) MOSFET Using ESS (empty space in silicon) Technique for SoC Applications” International Electron Devices Meeting 2001. Technical Digest. Washington, DC, Dec. 2-5, 2001, New York, NY: IEEE, U.S., Dec. 2, 2001, pp. 3771-3774, XP010575245 ISBN: 0-7803-7050-3.

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