4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Flip chip

Monica Harrison

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Electronic system modules and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated...
Reexamination Certificate

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Flip chip bonded package applicable to fine pitch technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Flip chip bonded package applicable to fine pitch technology

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Manufacturing method for a semiconductor substrate...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Method of making ferroelectric thin film having a randomly...

Semiconductor device manufacturing: process – Having magnetic or ferroelectric component
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Profile ID: LFUS-PAI-P-2367350

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