Plasma reactor with reduced electrical skew using electrical...

Details Plasma reactor with reduced electrical skew using electrical... Plasma reactor with reduced electrical skew using electrical...

2011-08-02

2011-08-02

Alejandro, Luz L. (Department: 1716)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

Having glow discharge electrode gas energizing means

C156S345470, C156S345480, C118S7230AN, C118S7230ER, C118S7230IR

Reexamination Certificate

active

07988815

ABSTRACT:
RF ground return current flow is diverted away from asymmetrical features of the reactor chamber by providing bypass current flow paths. One bypass current flow path avoids the pumping port in the chamber floor, and comprises a conductive symmetrical grill extending from the side wall to the grounded pedestal base. Another bypass current flow path avoids the wafer slit valve, and comprises an array of conductive straps bridging the section of the sidewall occupied by the slit valve.

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U.S. Appl. No. 11/828,713, Rauf et al.
Official Action Dated Feb. 1, 2011 Issued in Co-Pending U.S. Appl. No. 11/828,713.

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