4. Surgery
  5. Means and methods for collecting body fluids or waste material
  6. Absorbent pad for external or internal application and...

Yu-Ren Chen

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Chip package

Active solid-state devices (e.g. – transistors – solid-state diode – Incoherent light emitter structure – With reflector – opaque mask – or optical element integral...
Reexamination Certificate

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Chip package structure and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With bumps on ends of lead fingers to connect to semiconductor
Reexamination Certificate

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Circuit and method for generating circuit power on reset signal

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Synchronizing
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Circuit and method for generating circuit power on reset signal

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Synchronizing
Reexamination Certificate

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Dice rearrangement package structure using layout process to...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
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Profile ID: LFUS-PAI-P-1269220

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