Dice rearrangement package structure using layout process to...

Details Dice rearrangement package structure using layout process to... Dice rearrangement package structure using layout process to...

2011-04-19

2011-04-19

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S124000

Reexamination Certificate

active

07927922

ABSTRACT:
A dice rearrangement package structure is provided, which a dice having an active surface and a bottom surface, and a plurality of pads is disposed on the active surface; a package body is provided to cover the dices and the plurality of pads being exposed; one ends of plurality of metal traces is electrically connected to the each pads; a protection layer is provided to cover the active surface and the other ends of the exposed metal traces is electrically connected to the plurality of conductive elements, the characteristic in that the package body is a B-stage material.

REFERENCES:
patent: 5879964 (1999-03-01), Paik et al.
patent: 6103554 (2000-08-01), Son et al.
patent: 6825553 (2004-11-01), Chua et al.
patent: 6830958 (2004-12-01), Makimoto
patent: 6858799 (2005-02-01), Hedler et al.
patent: 6867471 (2005-03-01), Goller et al.
patent: 6867479 (2005-03-01), Hubner
patent: 6873060 (2005-03-01), Blaszczak et al.
patent: 6897096 (2005-05-01), Cobbley et al.
patent: 6905891 (2005-06-01), Kovar et al.
patent: 6919232 (2005-07-01), Hedler et al.
patent: 6964881 (2005-11-01), Chua et al.
patent: 6965160 (2005-11-01), Cobbley et al.
patent: 7002245 (2006-02-01), Huang et al.
patent: 7011989 (2006-03-01), Becker et al.
patent: 7037761 (2006-05-01), Hedler et al.
patent: 7061123 (2006-06-01), Chee et al.
patent: 7074696 (2006-07-01), Frankowsky et al.
patent: 7087992 (2006-08-01), Chua et al.
patent: 7091595 (2006-08-01), Fuergut et al.
patent: 7163843 (2007-01-01), Kiendl et al.
patent: 7196408 (2007-03-01), Yang et al.
patent: 7202107 (2007-04-01), Fuergut et al.
patent: 7223320 (2007-05-01), Arneson et al.
patent: 7223639 (2007-05-01), Blaszczak et al.
patent: 7238602 (2007-07-01), Yang
patent: 7662667 (2010-02-01), Shen

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