Yu-Mei Hsu

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Leadframe and semiconductor package having downset baffle...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Leadframe-based semiconductor package having arched bend in...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Semiconductor device with wire-bonding on multi-zigzag fingers

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor package having isolated inner lead

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified configuration
Reexamination Certificate

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Design Patent

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Profile ID: LFUS-PAI-P-2375236

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