Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate
2008-06-05
2009-11-17
Soward, Ida M (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With contact or lead
C257S666000, C257S670000, C257S676000, C257S690000, C257S696000, C257SE23031, C257SE23032, C257SE23043, C257SE23045, C257SE23046, C257SE23047, C257SE23048, C257SE23050, C257SE23170
Reexamination Certificate
active
07619307
ABSTRACT:
A leadframe-based semiconductor package and a leadframe for the package are revealed. The semiconductor package primarily includes parts of the leadframe including one or more first leads, one or more second leads, and a supporting bar disposed between the first leads and the second leads and further includes a chip attached to the first leads, the second leads and the supporting bar, a plurality of bonding wires and an encapsulant. The supporting bar has an extended portion projecting from the first bonding finger and the second bonding finger and connected to a non-lead side of the encapsulant wherein the extended portion has an arched bend to absorb the pulling stresses and to block stress transmission. Cracks caused by delamination of the supporting bar will not be created during trimming the supporting bar along the non-lead side of the encapsulant. Moisture penetration along the cracks of the supporting bar to the die-bonding plane under the chip is desirably prevented.
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Hsieh Wan-Jung
Hsu Yu-Mei
Wang Chin-Fa
Muncy Geissler Olds & Lowe, PLLC
Powertech Technology Inc.
Soward Ida M
LandOfFree
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