Leadframe and semiconductor package having downset baffle...

Details Leadframe and semiconductor package having downset baffle... Leadframe and semiconductor package having downset baffle...

2008-03-04

2010-10-12

Toledo, Fernano L (Department: 2895)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

With separate tie bar element or plural tie bars

C257SE21502, C257S690000, C257S675000, C257S796000, C257S711000, C257S712000, C438S123000

Reexamination Certificate

active

07812430

ABSTRACT:
A lead frame with downset baffle paddles and a semiconductor package utilizing the same are revealed. The lead frame primarily comprises a plurality of leads formed on a first plane, a baffle paddle formed on a second plane in parallel, and an internal tie bar formed between the first plane and the second plane. The internal tie bar has at least two or more windings such as “S” shaped to flexibly connect the baffle paddle to an adjacent one of the leads. Therefore, the internal tie bar can reduce the shifting and twisting of the connected lead during the formation of the downset of the baffle paddle.

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