Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate
2008-03-09
2010-10-26
Toledo, Fernando L (Department: 2895)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
C438S121000, C257S784000, C257SE23141, C257SE21001, C257S670000, C257SE23043, C257S672000, C257S676000, C257S690000, C257SE23052, C257S669000, C257S667000, C257S777000
Reexamination Certificate
active
07821112
ABSTRACT:
A semiconductor device having linear zigzag(s) for wire bonding is revealed, primarily comprising a chip, a plurality of leads made of a lead frame and a plurality of bonding wires electrically connecting the chip and the leads. At least one of the leads has a linear zigzag including a first finger and a second finger connected each other in a zigzag form. One end of one of the bonding wire is bonded to a bonding pad on the chip and the other end is selectively bonded to either the first finger or the second finger but not both in a manner that the wire-bonding direction of the bonding wire is parallel to or in a sharp angle with the direction of the connected fingers for easy wire bonding processes. Therefore, the semiconductor device can assemble chips with diverse dimensions or with diverse bonding pads layouts by flexible wire-bonding angles at linear zigzag to avoid electrical short between the adjacent leads.
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Fan Wen-Jeng
Hsu Yu-Mei
Muncy Geissler Olds & Lowe, PLLC
Powertech Technology Inc
Singal Ankush k
Toledo Fernando L
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