Composite bump structure and methods of fabrication

Details Composite bump structure and methods of fabrication Composite bump structure and methods of fabrication

1994-05-06

1995-02-28

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437189, 437190, 437192, 437203, H01L 2144

Patent

active

053936973

ABSTRACT:
A composite bump structure and methods of forming the composite bump structure. The composite bump structure comprises a polymer body of relatively low Young's Modulus compared to metals covered by a conductive metal coating formed at the input/output pads of an integrated circuit element or substrate. The composite bump is formed using material deposition, lithography, and etching techniques. A layer of soldering metal can be formed on the composite bumps if this is desired for subsequent processing.

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