Composite bump flip chip bonding

Details Composite bump flip chip bonding Composite bump flip chip bonding

1994-05-06

1995-07-11

Heinrich, Samuel M.

Metal fusion bonding

Process

Plural joints

2281231, 228254, 228106, H01L 2160

Patent

active

054313287

ABSTRACT:
A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

REFERENCES:
patent: 3401126 (1968-09-01), Miller et al.
patent: 3809625 (1974-05-01), Brown et al.
patent: 4402450 (1983-09-01), Abraham et al.
patent: 4705205 (1987-11-01), Allen et al.
patent: 4749120 (1988-06-01), Hatada
patent: 4903889 (1990-02-01), Svendson et al.
patent: 4916523 (1990-04-01), Sokolovsky et al.
patent: 4963002 (1990-10-01), Tagusa et al.
patent: 5134460 (1992-07-01), Brady et al.
patent: 5329423 (1994-07-01), Scholz
IBM Technical Disclosure Bulletin, W. C. Ward, "Pressure Contact Type Chip Join Technique", vol. 18, No. 9, p. 2817, Feb. 1976.

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