4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Young Limb

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Adhesion layer for Pt on SiO 2

Stock material or miscellaneous articles – Composite – Of silicon containing
Reexamination Certificate

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CMOS device and process

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
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Denuding a semiconductor substrate

Fishing – trapping – and vermin destroying
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Method of removing contaminants

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Method to prevent oxygen out-diffusion from BSTO containing...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
Reexamination Certificate

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Profile ID: LFUS-PAI-P-738566

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