BGA package using a dummy ball and a repairing method thereof

Details BGA package using a dummy ball and a repairing method thereof BGA package using a dummy ball and a repairing method thereof

1998-02-17

2000-01-04

Heinrich, Samuel M.

Metal fusion bonding

Process

With measuring, testing, indicating, inspecting, or...

228119, B23K 3102, H05K 334

Patent

active

060100583

ABSTRACT:
In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90.degree. around the dummy balls. When a defect occurs in a solder joint, the package can be easily repaired by finding defective active ball; forming a repair hole by using a cutting means at a predetermined portion of the printed circuit board corresponding to a central position between the dummy ball and the defectively soldered active ball; inserting a solder paste injector into the repair hole to inject solder thereinto; and mutually connecting pad extensions of the dummy ball and the defective active ball with the injected solder. Therefore, the overall process can be simplified and its reliability can be improved.

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