Components, methods and assemblies for multi-chip packages

Details Components, methods and assemblies for multi-chip packages Components, methods and assemblies for multi-chip packages

2006-06-13

2006-06-13

Potter, Roy (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S700000

Reexamination Certificate

active

07061122

ABSTRACT:
An ultra thin system-in-a-package (SIP) with independent test and repair capability comprises an interposer having arranged on a top surface and a bottom surface thereof a number of packaged semiconductor chips mounted via solder bumps in accordance with a Land Grid Array (LGA) format and wherein no underfill is used on the SIP.

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