Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2011-05-03
2011-05-03
Pert, Evan (Department: 2826)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C257SE21705
Reexamination Certificate
active
07935569
ABSTRACT:
A bottom unit including a bottom unit semiconductor chip is mounted to a circuit board and one or more top elements such as packaged semiconductor chips are mounted to the bottom unit. Both mounting operations can be performed using the same techniques as commonly employed for mounting components to a circuit board. Ordinary packaged chips can be employed as the top elements, thereby reducing the cost of the assembly and allowing customization of the assembly by selecting packaged chips. The assembly achieves benefits similar to those obtained with a preassembled stacked chip unit, but without the expense of special handling of the bare dies included in the packaged chips.
REFERENCES:
patent: 3390308 (1968-06-01), Marley
patent: 3923359 (1975-12-01), Newsam
patent: 4371744 (1983-02-01), Badet et al.
patent: 4371912 (1983-02-01), Guzik
patent: 4489364 (1984-12-01), Chance
patent: 4540226 (1985-09-01), Thompson et al.
patent: 4551746 (1985-11-01), Gilbert et al.
patent: 4558397 (1985-12-01), Olsson
patent: 4638348 (1987-01-01), Brown et al.
patent: 4734825 (1988-03-01), Peterson
patent: 4754316 (1988-06-01), Reid
patent: 4761681 (1988-08-01), Reid
patent: 4841355 (1989-06-01), Parks
patent: 4868712 (1989-09-01), Woodman
patent: 4897918 (1990-02-01), Osaka et al.
patent: 4956694 (1990-09-01), Eide
patent: 4982265 (1991-01-01), Watanabe et al.
patent: 4994902 (1991-02-01), Okahashi et al.
patent: 4996583 (1991-02-01), Hatada
patent: 4996587 (1991-02-01), Hinrichsmeyer et al.
patent: 5028986 (1991-07-01), Sugano et al.
patent: 5045921 (1991-09-01), Lin et al.
patent: 5117282 (1992-05-01), Salatino
patent: 5128831 (1992-07-01), Fox, III et al.
patent: 5138438 (1992-08-01), Masayuki et al.
patent: 5148265 (1992-09-01), Khandros et al.
patent: 5172303 (1992-12-01), Bernardoni et al.
patent: 5198888 (1993-03-01), Sugano et al.
patent: 5222014 (1993-06-01), Lin
patent: 5239198 (1993-08-01), Lin et al.
patent: 5247423 (1993-09-01), Lin et al.
patent: 5266912 (1993-11-01), Kledzik
patent: 5281852 (1994-01-01), Normington
patent: 5311401 (1994-05-01), Gates, Jr. et al.
patent: 5313096 (1994-05-01), Eide
patent: 5334875 (1994-08-01), Sugano et al.
patent: 5337077 (1994-08-01), Browne
patent: 5376825 (1994-12-01), Tukamoto et al.
patent: 5384689 (1995-01-01), Shen
patent: 5397916 (1995-03-01), Normington
patent: 5412247 (1995-05-01), Martin
patent: 5455740 (1995-10-01), Burns
patent: 5479318 (1995-12-01), Burns
patent: 5489749 (1996-02-01), DiStefano et al.
patent: 5518964 (1996-05-01), DiStefano et al.
patent: 5543664 (1996-08-01), Burns
patent: 5548091 (1996-08-01), DiStefano et al.
patent: 5552631 (1996-09-01), McCormick
patent: 5552963 (1996-09-01), Burns
patent: 5600541 (1997-02-01), Bone et al.
patent: 5608265 (1997-03-01), Kitano et al.
patent: 5616958 (1997-04-01), Laine et al.
patent: 5625221 (1997-04-01), Kim et al.
patent: 5637536 (1997-06-01), Val et al.
patent: 5639695 (1997-06-01), Jones et al.
patent: 5642261 (1997-06-01), Bond et al.
patent: 5656856 (1997-08-01), Kweon
patent: 5659952 (1997-08-01), Kovac et al.
patent: 5668405 (1997-09-01), Yamashita
patent: 5677566 (1997-10-01), King et al.
patent: 5679977 (1997-10-01), Khandros et al.
patent: 5681777 (1997-10-01), Lynch et al.
patent: 5701031 (1997-12-01), Oguchi et al.
patent: 5715144 (1998-02-01), Ameen et al.
patent: 5734555 (1998-03-01), McMahon
patent: 5751063 (1998-05-01), Baba
patent: 5783870 (1998-07-01), Mostafazadeh et al.
patent: 5784264 (1998-07-01), Tanioka
patent: 5801072 (1998-09-01), Barber
patent: 5801439 (1998-09-01), Fujisawa et al.
patent: 5804874 (1998-09-01), An et al.
patent: 5834339 (1998-11-01), DiStefano et al.
patent: 5835988 (1998-11-01), Ishii et al.
patent: 5844315 (1998-12-01), Melton et al.
patent: 5861666 (1999-01-01), Bellaar
patent: 5883426 (1999-03-01), Tokuno et al.
patent: 5915752 (1999-06-01), DiStefano et al.
patent: 5956234 (1999-09-01), Mueller
patent: 6002167 (1999-12-01), Hatano et al.
patent: 6030856 (2000-02-01), DiStefano et al.
patent: 6054756 (2000-04-01), DiStefano et al.
patent: 6072233 (2000-06-01), Corisis et al.
patent: 6093029 (2000-07-01), Kwon et al.
patent: 6137164 (2000-10-01), Yew et al.
patent: 6180881 (2001-01-01), Isaak
patent: 6184577 (2001-02-01), Takemura et al.
patent: 6195268 (2001-02-01), Eide
patent: 6218848 (2001-04-01), Hembree et al.
patent: 6232152 (2001-05-01), DiStefano et al.
patent: 6268649 (2001-07-01), Corisis et al.
patent: 6281042 (2001-08-01), Ahn et al.
patent: 6291259 (2001-09-01), Chun
patent: 6300161 (2001-10-01), Goetz et al.
patent: 6303997 (2001-10-01), Lee et al.
patent: 6313522 (2001-11-01), Akram et al.
patent: 6335565 (2002-01-01), Miyamoto et al.
patent: 6337510 (2002-01-01), Chun-Jen et al.
patent: 6342728 (2002-01-01), Miyazaki et al.
patent: 6344682 (2002-02-01), Tomita
patent: 6359235 (2002-03-01), Hayashi
patent: 6369445 (2002-04-01), Khoury
patent: 6376917 (2002-04-01), Takeshita et al.
patent: 6388264 (2002-05-01), Pace
patent: 6388333 (2002-05-01), Taniguchi et al.
patent: 6407448 (2002-06-01), Chun
patent: 6414384 (2002-07-01), Lo et al.
patent: 6437990 (2002-08-01), Degani et al.
patent: 6462421 (2002-10-01), Hsu et al.
patent: 6476331 (2002-11-01), Kim et al.
patent: 6479321 (2002-11-01), Wang et al.
patent: 6496026 (2002-12-01), Long et al.
patent: 6515870 (2003-02-01), Skinner et al.
patent: 6521845 (2003-02-01), Barrow
patent: 6680212 (2004-01-01), Degani et al.
patent: 6734539 (2004-05-01), Degani et al.
patent: 6765288 (2004-07-01), Damberg
patent: 7294928 (2007-11-01), Bang et al.
patent: 2001/0046129 (2001-11-01), Broglia et al.
patent: 2002/0079568 (2002-06-01), Degani et al.
patent: 2002/0081755 (2002-06-01), Degani et al.
patent: 2002/0127771 (2002-09-01), Akram et al.
patent: 2003/0042587 (2003-03-01), Lee
patent: 2003/0042591 (2003-03-01), Goller et al.
patent: 2003/0110452 (2003-06-01), Leahy et al.
patent: 2003/0122240 (2003-07-01), Lin et al.
patent: 2004/0021210 (2004-02-01), Hosomi
patent: 2004/0021211 (2004-02-01), Damberg
patent: 2004/0145054 (2004-07-01), Bang et al.
patent: 2004/0178508 (2004-09-01), Nishimura et al.
patent: 2004/0232564 (2004-11-01), Cher'Khng et al.
patent: 52-075981 (1977-06-01), None
patent: 56-61151 (1981-05-01), None
patent: 57-31166 (1982-02-01), None
patent: 58-178529 (1983-10-01), None
patent: 60-194548 (1984-03-01), None
patent: 61-029140 (1986-02-01), None
patent: 61-101067 (1986-05-01), None
patent: 61-120454 (1986-06-01), None
patent: 61-137335 (1986-06-01), None
patent: 61-255046 (1986-11-01), None
patent: 63-18654 (1988-01-01), None
patent: 62-226307 (1989-03-01), None
patent: 64-71162 (1989-03-01), None
patent: 03019654 (2003-03-01), None
Damberg, U.S. Appl. No. 60/401,391, filed Aug. 5, 2002.
“Megabyte Per Cubic Inch,” Defense Science, May 1988, p. 56.
“Three-Dimensional Packaging,” Defense Science, May 1988, p. 65.
Newsam, U.S. Appl. No. 60/314,042, filed Aug. 22, 2001.
Forthun, U.S. Appl. No. 07/552,578, filed Jul. 13, 1990.
Bang Kyong-Mo
Gibson David
Kim Young-Gon
Riley, III John B.
Lerner David Littenberg Krumholz & Mentlik LLP
Pert Evan
Tessera Inc.
LandOfFree
Components, methods and assemblies for stacked packages does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Components, methods and assemblies for stacked packages, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Components, methods and assemblies for stacked packages will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2623525