BGA package using a dummy ball and a repairing method thereof

Details BGA package using a dummy ball and a repairing method thereof BGA package using a dummy ball and a repairing method thereof

1996-04-23

1998-05-05

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, 257738, 361774, 361779, 361805, 361767, H05K 702, H01R 909

Patent

active

057484503

ABSTRACT:
In a BGA package having electrically connected active balls and electrically disconnected dummy balls, the active balls are positioned in a radial direction at intervals of 90.degree. around the dummy balls. When a defect occurs in a solder joint, the package can be easily repaired by finding defective active ball; forming a repair hole by using a cutting means at a predetermined portion of the printed circuit board corresponding to a central position between the dummy ball and the defectively soldered active ball; inserting a solder paste injector into the repair hole to inject solder thereinto; and mutually connecting pad extensions of the dummy ball and the defective active ball with the injected solder. Therefore, the overall process can be simplified and its reliability can be improved.

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