4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Small lead frame for connecting a large lead frame to a...

Yoshihiro Hosoi

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Covering metal structure for metallized metal layer in electroni

Stock material or miscellaneous articles – All metal or with adjacent metals – Composite; i.e. – plural – adjacent – spatially distinct metal...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Method for producing wiring substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Semiconductor device having improved heat resistance

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Small lead frame for connecting a large lead frame to a...
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Wiring substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Yoshihiro Hosoi does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with Yoshihiro Hosoi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Yoshihiro Hosoi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-1481042

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure