Covering metal structure for metallized metal layer in electroni

Details Covering metal structure for metallized metal layer in electroni Covering metal structure for metallized metal layer in electroni

1985-10-23

1986-12-02

Rutledge, L. Dewayne

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428665, 428672, 428680, 428936, 357 71, B32B 1504

Patent

active

046264795

ABSTRACT:
A surface metal layer composed mainly of gold is formed on the surface of a metallized metal layer on an insulating substrate through a first intermediate metal layer composed of a nickel/boron alloy and a second intermediate metal layer composed of a nickel/phosphorus alloy. In this surface layer, appearance of stains or occurrence of blistering is prevented, and this surface metal layer is excellent in appearance characteristics, electric characteristics and durability.

REFERENCES:
patent: 3362851 (1968-01-01), Dunster
patent: 3539390 (1970-11-01), Widmann et al.
patent: 3663184 (1972-05-01), Wood et al.
patent: 3761309 (1973-09-01), Schmitter et al.
patent: 3977840 (1976-08-01), Estep et al.
patent: 4503131 (1985-03-01), Baudrand
"Nickel/Gold Diffusion Barrier", J. R. Lynch, IBM Technical Disclosure Bulletin, vol. 14, No. 4, 9/71, p. 1099.

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