Method for producing wiring substrate

Details Method for producing wiring substrate Method for producing wiring substrate

2006-03-14

2006-03-14

Talbot, Brian K. (Department: 1762)

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

C427S097100, C427S099100, C427S099500, C427S304000, C427S437000, C427S443100

Reexamination Certificate

active

07011862

ABSTRACT:
An object of the invention is to prevent the color on a surface of a plated metal layer from changing. The invention is a wiring substrate obtained by forming a wiring conductor made of a metal having a high melting point on an insulator, and coating a surface of the wiring conductor with an electroless plated metal layer, wherein the electroless plated metal layer contains an element of Group 1B and is free from lead.

REFERENCES:
patent: 4863758 (1989-09-01), Rhodenizer
patent: 5838069 (1998-11-01), Itai et al.
patent: 02-104671 (1990-04-01), None
patent: 04-349690 (1992-12-01), None
patent: 10-135606 (1998-05-01), None
patent: 2000-195989 (2000-07-01), None

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